All Categories
Qalabka Baakadaha Aan Organic
CMP polishing abrasive
suufka dhalaalaysa ee CMP
CMP polishing abrasive
suufka dhalaalaysa ee CMP

CMP polishing abrasive


Iyo meesha Asal ahaan: Shiinaha
Magaca Brand: Semixlab
Number Model: SXL-1
Certification: ISO14001, ISO45001, ISO9001
Order Tirada Yar ee: Ku xiran gorgortanka
Price: Xidhiidhka Xigasho Gaar ah
Details Baako: Xidhmada dhoofinta caadiga ah
Waqtiga dirida: 15-30 Maalmood Kadib Xaqiijinta Amarka
Shuruudaha Payment: T / T
Supply Kartida: 10 oo tan/Bishii
Description

CMP (Qorsheynta Farsamada Kiimikada) naaxinta abrasive waa shay muhiim ah oo ku saabsan dhinacyada wax soo saarka semiconductor, muraayadaha indhaha, wareegyada isku dhafan, iwm.

Codsiga:

CMP polishing abrasives waa agab muhiim ah oo ku saabsan wax soo saarka wareegga isku dhafan waxaana loo isticmaali karaa ILD-ka isku dhafan ee wareegga wareegga ah, semiconductor monocrystalline silicon wafers, semiconductor silicon carbide, go'doominta wareegga gaaban ee isku dhafan (STI), polysilicon isku dhafan (Poly - Si), biraha wareegga isku dhafan iyo lakabyada birta.

Adeegyada la bixin karo:

Falanqaynta xaaladda codsiga macaamiisha, agabka u dhigma, xallinta dhibaatada farsamada.

Astaanta shirkadda:

Semixlab waxay leedahay 2 shaybaar, koox khubaro ah oo leh 20 sano oo waayo-aragnimo agab ah, oo leh R&D iyo awoodaha wax soo saarka, tijaabinta iyo xaqiijinta.

sooc

Tilmaamayaasha Waxqabadka ee Alaabooyinka Taxanaha Nadiifinta Sare-sare

dhimaya SXL-1 SXL-2 SXL-3 SXL-4 SXL-5 SXL-6 SXL-7
Celceliska Cabbirka Qaybka Silica/nm 35 ± 5 45 ± 5 65 ± 5 75 ± 5 85 ± 5 100 ± 5 120 ± 5
Cabbirka Nanoparticle Qaybinta (PDI)
Xalka pH 7.2-7.4 7.2-7.4 7.2-7.4 7.2-7.4 7.2-7.4 7.2-7.4 7.2-7.4
Waxyaabaha Adag/% 20.5 ± 0.5 20.5 ± 0.5 20.5 ± 0.5 20.5 ± 0.5 20.5 ± 0.5 20.5 ± 0.5 20.5 ± 0.5
Imaanshaha Light Blue Blue White Kaar-Cad Kaar-Cad Kaar-Cad Kaar-Cad
Qaybta Morfology X X:S- pherical;B- Qalloocan
Xasilinta Iions Amines organic/Inorganic
Halabuurka walxaha ceeriin Y Y:M-TMOS;E-TEOS;ME-TMOS+TEOS;EM-TEOS+TMOS
Waxyaabaha ka kooban wasakhda birta ≤300ppb
Codsiyada

Goobaha codsiga ee ugu muhiimsan

Jihada codsiga Xaalad caadi ah
Wax-soo-saarka Semiconductor Chips-ka Isku-dhafan ee Wareegga (IC) iyo Qalabka Semiconductor-ka Jiilka Saddexaad
Tignoolajiyada Optics iyo Bandhigga Muraayadaha indhaha, muraayadaha iyo muraayadda
Aaladda Kaydinta Platters Hard Disk-ga iyo 3D NAND flash memory
Baakadaha horumarsan Baakadaha heerka wafer (WLP), TSV (iyada oo loo marayo silicon iyada oo loo marayo)
Codsiyada kale ee dhamaadka-sare MEMS (Nidaamka Micro-Electro-Mechanical) iyo Qalabyada Caafimaadka

Taageerada xaqiijinta silsiladda deegaanka

Semixlab CMP polishing abrasives waxay la kulmaan shahaadada warshadaha semiconductor waxayna ka gudbeen shahaadada ISO 14001/45001/9001

Habka codsiga caadiga ah

Waxyaabo ceeriin ah → Isku-dhafka Abrasive (Wax ka beddelka dusha sare) → Qaabaynta qulqulka (shaandhaynta / hagaajinta PH) → polishing CMP (control EPD)

Iyada oo la adeegsanayo hagaajinta cabbirka, Semixlab CMP polishing abrasive wuxuu gaadhay horumar horumarsan oo ku saabsan wareegga isku-dhafan ee-dhamaadka-sare ee gudaha, wuxuu si tartiib tartiib ah u beddelay soo dejinta suuqa semiconductor, waxaana si guul leh loogu dabaqay wax-soo-saarka iyo soo-saarka LCD, OLED iyo muraayadaha kale ee bandhigga. Haddii aad u baahan tahay inaad hesho waraaqo cadcad oo tifaftiran oo faahfaahsan ama aad diyaarsato tijaabada muunad, fadlan la xidhiidh kooxdayada taageerada farsamada.

Advantage tartanka

Semixlab CMP polishing faa'iidooyinka xudunta u ah abrasive

a. Dhexroorka walxaha si xor ah loo hagaajin karo iyo heerka isku-darka walxaha;

b.Monodisperse qaybo leh qaybinta cabbirka walxaha lebis;

c.Nidaamka kala firdhinta xasilloon;

d.Awoodda wax-soo-saarka baaxadda weyn oo leh kala duwanaansho yar-ilaa-dufcad;

e. Aad u deggan, adkaysi u leh agglomeration iyo sedimentation.

Adeegyada aan bixino

Dukaanka wax soo saarka Semixlab

Semixlab CMP dukaamada dhaldhalaalka ah

WEYDIISASHADA

Qaybaha kulul