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CVD Tantalum Carbide (TaC) Dahaarka

CVD Tantalum Carbide (TaC) Dahaarka

Bogga Hore > Alaabta > Dahaadhka CVD > Dahaadhka CVD Tantalum Carbide (TaC)

6 inch TaC kuleyliyaha garaafka dahaarka leh
6 inch TaC kuleyliyaha garaafka dahaarka leh

6 inch TaC kuleyliyaha garaafka dahaarka leh


Kuleyliyahayaga 6-inji ah ee dahaarka leh ee TaC waxaa loogu talagalay hababka heerkul-ku-kulul sare sida epitaxy, CVD, RTP, iyo faafinta. Lagu dhisay substrate graphite cufnaanta sare leh oo lagu ilaalinayo daahan tantalum carbide (TaC), kuleyliyahani wuxuu hubinayaa qaybinta kulaylka isku midka ah, iska caabinta daxalka oo aad u fiican, iyo nolosha adeega fidsan ee gaasaska ku saleysan halogen iyo xaaladaha balaasmaha. Qaab-dhismeedkeeda saxda ah iyo isku-xidhka is-dhexgalka xasilloon ayaa ka dhigaya lama huraan ilaalinta tayada wafer-ka, xasilloonida habka, iyo hufnaanta wax-soo-saarka ee wax-soo-saarka semiconductor sare.

Description

Semixlab's 6-inch TaC-dahaarka kuleyliyeyaasha garaafyada sida caadiga ah waxay isticmaalaan substrate si gooni ah loo riixay ama cufnaanta sare leh. Wareegga kuleyliyaha (sida caadiga ah dunta xoogga leh ama qaab wareeg ah) ayaa la farsameeyay waxaana lakabka difaaca ee tantalum carbide (TaC) lagu dhejiyay dusha sare ama meelaha muhiimka ah. Kuleyliyeyaashani waxay isticmaalaan kuleyliyaha iska caabinta si ay u siiyaan kuleyl heer sare ah oo la isku halleyn karo si toos ah maraqyada yar yar (tusaale, 6"/150 mm) ama kuwa wax u dhimaya

Ⅰ Doorarka Habraacyada Semiconductor-ka Waaweyn

1. Epitaxy (SiC, GaN, iyo Si Layers)

Geedi socodka koritaanka epitaxial, kuleyliyaha 6 inji TaC dahaarka leh ee garaafiga ah waa unug kuleyl udub dhexaad ah oo mas'uul ka ah gaarista kuleyliyaha substrate deggan oo isku mid ah. Xakamaynta heerkulka saxda ah ayaa lagama maarmaan u ah ilaalinta lebbiska dhumucda lakabka, tayada crystal, iyo yaraynta cilladaha ee SiC, GaN, iyo Si epitaxy. Dahaarka TaC wuxuu ka ilaaliyaa substrate-ka garaafyada ka soo baxa gaasaska koloriin ku jira iyo hydrogen-ku-saleysan, kuwaas oo aad u daxaleeya heerkulka sare. Tani waxay xaqiijinaysaa nolosha adeeg dheer iyadoo ka hortagaysa faddaraynta iyo sii daynta walxaha qolka.

2. Dhigista Uumiga Kiimikada (CVD / MOCVD / PECVD)

Nidaamyada CVD iyo MOCVD, kuleyliyeyaasha ayaa muhiim u ah ilaalinta jawiga kontoroolka ah ee koritaanka filimada khafiifka ah. Dahaarka TaC wuxuu bixiyaa caabbinta nabaad-guurka balaasmaha iyo qallafsanaanta kiimikada, taasoo ka dhigaysa kuleyliyaha ku habboon deegaanka PECVD iyo LPCVD halkaasoo noocyada fluorine iyo koloriin lagu isticmaalo. Dheecaankeeda sare iyo dhaqdhaqaaqa kulaylka waxay hubisaa kuleylka degdega ah iyo heerkulka qaboojinta, kor u qaadista xasilloonida habka.

3. Hannaanka faafinta iyo tirtiridda

Inta lagu jiro fidinta dabaysha heerkulka-sare iyo soo saarista tallaalka ka dib, kuleylinta labbiska ah ayaa muhiim u ah gaaritaanka firfircoonida dopant-ka saxda ah iyo muuqaalada faafinta. Kuleyliyaha garaafiga ee dahaarka leh ee TaC wuxuu yareeyaa diiqada kulaylka wuxuuna xaqiijiyaa jawiga wafer-ka la kantaroolo. Iska caabbinta oksaydhka iyo baaskiil wadida kulaylka waxay wanaajisaa isku halaynta iyo ku celcelinta geedi socodka badan.

Xaaladaha codsiga kululeeyaha TaC

4. Daawaynta cuncunka iyo dusha sare

Deegaannada etching qalalan, kuleyliyeyaasha lagu dahaadhay TaC waxay u shaqeeyaan sidii goobo kululaynta substrate oo u adkeysaneysa xaaladaha balaasaha ee fluorine- iyo koloriin-ku-saleysan. Dahaarku wuxuu ka ilaaliyaa saldhigga garaafka nabaad guurka iyo sii deynta walxaha, iyadoo la ilaalinayo xasilloonida kuleylka dusha sare ee wafer. Tani waxay keenaysaa hagaajinta saxnaanta etching iyo hoos u dhaca wasakheynta qolka.


Ⅱ Qalabka iyo Qaababka Muhiimka ah:

Susceptor Graphite: Dhaqdhaqaaq koronto oo heer sare ah, kuleyl kuleyl oo sarreeya, awood mashiin xoog leh, iyo awoodda kulaylka hooseeya (oo u janjeerta heerkulka degdega ah).

Qaabka Wareegga Kuleyliyaha: Siddooyin isku dhafan/spirals ayaa loo isticmaalaa si loo gaaro isku mid ahaanshaha heerkulka shucaaca; isku xidhka aaga badan ayaa loo isticmaali karaa in si fiican loo habeeyo heerkulbeegyada/ weecashooyinka.

TaC (Tantalum Carbide) Dahaarka: Bar dhalaalaysa sare (≈3880°C), adkaanta sare, caabbinta kiimikaad iyo balaasmaha, iyo korantada aad u fiican. Lakab difaac ahaan, waxa ay yaraynaysaa fal-celinta kiimikaad ee gaasaska habaysan, waxa ay yaraysaa daadinta walxaha, waxa ay kordhisaa nolosha.

Isku-xidhka Interface/Adhesion: Ku-xidhka u dhexeeya TaC iyo graphite, dhumucda daahan, iyo xakamaynta walbahaarka ayaa ah qodobbada xakamaynta habka muhiimka ah, saameeya nolosha iyo isku halaynta.


Ⅲ Geedi socodka caqabadaha iyo xalalka

Markaad isticmaalayso 6 inch TaC kuleyliyaha garaafiga ah ee dahaarka leh ee hababka semiconductor, waxaa jira dhowr dhibcood oo injineernimo oo u baahan taxadar taxadar leh. Wax ka qabashada arrimahan si sax ah waxay hubisaa waxqabadka xasilloon, nolol adeeg oo dheer, iyo tayada wafer joogto ah.

1. Isku-dhejinta Dahaarka iyo Khatarta diirka

Tartanka:

Haddii dahaarka TaC uusan si xooggan ugu xirin saldhigga garaafka, waxaa laga yaabaa inuu diiriyo ama dillaaco ka dib wareegyada kuleylka iyo qaboojinta soo noqnoqda. Tani waxay dhalin kartaa qaybo waxayna yaraynaysaa nolosha kuleyliyaha.

Solution:

● Codso diyaarinta dusha sare ka hor dahaadhka ( xoqin iyo nadiifin si loo kordhiyo xoogga isku xidhka).

● Isticmaal cabbirada CVD la hagaajiyay si aad u gaadho lakabka TaC cufan oo labbisan.

● Samee tijaabinta adhesionka inta lagu jiro kormeerka tayada si aad uga fogaato fashilada qarsoon.

2. Cadaadiska kulaylka iyo dildilaaca

Tartanka:

Heerkulka degdega ah ayaa isbeddela inta lagu jiro hababka sida RTP (Dhaqdhaqaaqa Thermal Processing) waxay abuuri kartaa cadaadis u dhexeeya graphite iyo lakabka TaC, taasoo keenta dildilaac ama qallafsanaan.

Solution:

● Ku naqshadee kuleyliyaha leh sifooyinka fidinta kulaylka ee u dhexeeya graphite iyo TaC.

● Isticmaal kuleyliyaha/qaboojiye la xakameeyey si loo yareeyo shoogga kulaylka.

● Shaqaalaysii saafi-sare, garaafka hadhuudhka-fiican leh ee balaadhinta kulaylka hoose ee substrate-ka.

3. Direyska kuleylinta Waferka

Tartanka:

Haddii dahaarka TaC ama saldhigga graphite uu leeyahay dhumuc aan sinnayn, waxay keeni kartaa dhibco kulul ama aagagga qabow, taasoo keenta cilladaha waferka.

Solution:

● Ku codso mashiinka saxda ah substrate-ka garaafyada iyadoo loo dulqaadanayo cabbir adag.

● Hubi isku midnimada dahaarka leh kontoroolka CVD horumarsan.

Isticmaal khariidad kuleyl ah inta lagu jiro xakamaynta tayada si aad u xaqiijiso qaybinta kulaylka joogtada ah.

4. Muddada adeegga iyo wareegga beddelka

Tartanka:

Waqti ka dib, xitaa kuleyliyeyaasha ugu fiican waxay hoos u dhacaan xaalado aad u daran, taasoo suurtogal ah inay keento waqti aan la filayn.

Solution:

● Samee jadwal beddelaad saadaaliya oo ku salaysan saacadaha shaqada iyo kimistariga gaaska.

● Gacanta ku hay kuleyliyeyaasha firaaqada ah si aad u yareyso hakadyada wax soo saarka.

● La shaqee alaab-qeybiyaha si aad u sameyso baaritaanka nolosha iyo falanqaynta guuldarada si loo horumariyo joogtada ah.

Nuxur ahaan, agabka iyo qaab dhismeedka kuleyliyaha garaafiga ee 6 inch TaC dahaarka leh waxay hubisaa xasilloonida heerkulka sare, iska caabinta daxalka, iyo sharafta qaabdhismeedka, taasoo ka dhigaysa qayb lama huraan u ah epitaxy horumarsan, CVD, iyo hababka faafinta. Xor baad u tahay inaad nagala tashato xalal dheeraad ah oo la habeeyey.

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